An additional disadvantage is the inspection of BTC components. If too little solder paste is applied, open solder joints (no contact), voids, etc. If too much solder paste is applied, the BTC component will “float” on the paste, which can cause a short circuit. The right amount of solder paste is critical for a good solder joint. The assembly process must be closely monitored. However, there are also disadvantages when using these BTC components. At the bottom, BTCs have a large cooling surface that excellently dissipates heat to the printed circuit board. Because they are so thin, they are very suitable for mobile phones and other consumer electronics. This makes them faster, lighter and cheaper than their predecessors. BTCs (as the name suggests) do not have leads (legs) on the side of the component but metallized surfaces on the bottom (bottom terminations). BTC-components are the “new generation” ICs that take up considerably less space than their “older” predecessors such as QFPs, SOICs, etc.
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